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| EPSI INC. - Electronics Packaging Solutions International Inc. P.O. Box 1522, Montclair, NJ 07042 USA, tel.: +1 (973)746-3796, fax: +1 (973)655-0815 e-mail: jpclech@aol.com |
Q4 2005
Q3 2005 * EPSI participation at Surface Mount International (SMTAI) Conference, Chicago, IL, September 25-29: We will offer two half-day tutorials: * A 1/2 day version of our BGA, Flip-Chip and Chip Scale Package Solder Joint Reliability workshop (Sept. 25, am). * A 1/2 day version of our lead-free solder joint reliability workshop (Sept. 25, pm). For further info (Tutorials # T9 & T10, respectively) and registration, go to the tutorials' section of the SMTAI web site at: http://www.smta.org/smtai/tutorials.cfm . Or download SMTAI '05 Conference Brochure. J-P. Clech will co-chair a technical session on lead-free solder joint reliability with Milos Dusek, National Physical Lab. (NPL), UK. This session is part of SMTAI's Lead-Free Symposium organized by Dr. Paul Vianco, Sandia National Labs. For the program of this technical session (Session # SOL4, Thursday, Sept. 29, 3 pm), visit the Symposium section of SMTAI' s web site at: http://www.smta.org/smtai/symposium.cfm . Go to session description. J-P. Clech will give paper: "Acceleration factors and thermal cycling test efficiency for lead-free Sn-Ag- Cu assemblies". If you cannot make it to Chicago, please note that a dial-in option is available to attend this session and other popular SMTAI events remotely. For further information and registration to the "dial-in" events, go to: http://www.smta.org/education/presentations/presentations.cfm or contact the SMTA at: tel. 952.920.7682 * Hobbs Engineering workshops, Sept. 21-23, Secaucus, NY/NJ area: We will offer: 1)Sept. 23: our full-day Lead-free Solder Joint Reliability workshop. Download 1-day workshop description. 2) Sept. 21-22: Our 2-day SMT Solder Joint Reliability workshop: a classic, all the fundamentals (solder mechanics, fatigue, failure modes & statistics, reliability of Ball Grid Arrays, Flip-Chip, Chip-Scale Package assemblies, life prediction, accelerated test plans etc..), plus new data & life prediction models for circuit boards under vibration loads. Download 2-day workshop description. For more info & registration, contact Hobbs Engineering. * ECTC PAPER: Re-print of paper: "An extension of the Omega method to primary and tertiary creep of lead-free solders" given by J-P. Clech during the 55th Electronic Components and Technology Conference, Orlando, FL, May 31-June 3, is now available for downloading in our publication section. ______________________________________________________________________________________________ Q2 2005 * Lead-free solder joint reliability workshop, Barcelona, Spain, June 10: Workshop to be held during IPC / Soldertec Global 3rd International Conference on Lead Free Electronics, June 7- 10. We will present the latest on lead-free reliability and acceleration factors during a one-day seminar: "Lead-free Solder Joint Reliability: Show Me the Data and Let's Make Sense Out of It". Includes new test data and analysis that validate acceleration factors for Sn-Ag-Cu assemblies. For more details on our one-day seminar, download Workshop Description (2 pages). For registration, visit IPC / Soldertec Global 3rd International Conference on Lead Free Electronics. Early sign-up is recommended since class size is limited. *New lead-free reliability workshops: San Jose, CA (May 4): full day workshop (the whole enchilada), to be held during Hobbs Engineering's 2005 HALT & HASS Symposium. For more info and registration, visit Hobbs Engineering Web Site. Nuremberg, Germany (April 19): Special workshop: "ZUVERLASSIGKEIT BLEIFREI" organized by Dr. Gundolf Reichelt (IBE - Ingenieurbüro für Elektroniktechnologie, Berlin, Germany). Workshop programme: * Dr.-Ing. Gundolf Reichelt, IBE (Berlin, Germany): Einfuhrung zur Zuverlassigkeit der bleifreien Lotverbindungern (9:00-9:30am) * Dr.-Ing. Sonja Wege, ZVE (Oberpfaffenhofen, Germany): Untersuchungen zur Zuverlassigkeit bleifreier Lotverbindungen unter Temperaturwechselbeanspruchung am ZVE (9:30-9:50am) * Dipl.-Ing. Ulrich Bohnenkamp, ZAVT GmbH (Lippstadt, Germany): Untersuchungen zur Zuverlassigkeit bleifreier Lotverbindungen unter Temperaturwechselbeanspruchung am ZAVT (9:50-10:10am) * Dipl.-Ing. Jud Pascal, EMPA (Switzerland): Ausfallcharakteristik als spezifische Materialeigenschaft? (10:10-10:40am) *Dr. Jean-Paul Clech, EPSI Inc. (Montclair, NJ, USA): SAC solder joints: test conditions and acceleration factors (11:10-11:50am) *Dr. Gundolf Reichelt, IBE (Berlin, Germany): Zusammenfassung und abschlussdiskussion (11:50-12:00am) For more info and registration, visit Mesago's SMT Hybrid Packaging Web Site. * EPSI Inc.'s presentation on lead-free solder creep curve simulations at ECTC'05, Orlando, FL, June 3, 2005: Paper title: "An Extension of the Omega Method to Primary and Tertiary Creep of Lead-Free Solders", by Clech, J.- P. An innovative, user-friendly simulation technique that enables the easy prediction of entire creep curves and rupture times for soft solders. The companion analysis of creep curves shows that, contrary to conventional wisdom, lead-free solders do not experience much, if any, steady-state creep and that both primary and tertiary creep are important. For further info on the 55th Electronic Components and Technology Conference (ECTC 2005) and registration information, visit: http://www.ectc.net. *EPSI Inc's participation at SMTAI'05, Chicago, IL (Sept. 25-29, 2005): Milos Dusek (National Physical Laboratory, UK) and Jean-Paul Clech (EPSI Inc.) will co-chair a special session on Lead-Free Reliability during the SMTAI Lead-Free Symposium. Details to follow when program of SMTA International (SMTAI) Conference becomes available at SMTA Web Site. J-P. Clech to give paper: "Acceleration factors and thermal cycling test efficiency for lead-free Sn-Ag-Cu assemblies" on Sept. 29 during SMTAI's Lead-Free Symposium. * Further validation of Sn-Ag-Cu acceleration factors: Acceleration factors for SAC assemblies have been validated against additional experimental data, including for mild conditions with temperature cycling of SAC assemblies between 30C and 80C. This is in addition to past validation for dwell time effects where our SAC reliability model was shown to capture the effect of dwell times at the temperature extremes accurately for dwell times from a few minutes to a couple of hours. The SAC acceleration factors use a strain-energy based approach to SAC solder life prediction. Results of these validation tests will be presented in all of our upcoming lead-free reliability workshops, starting with the one in Nuremberg on April 19. This is the "Show me the data and let's make sense out of it" part of the title of our updated lead-free reliability workshop. We have been developing SAC acceleration factors for customers with either long design life (up to 40 years) or harsh environment applications (underhood, aerospace, etc...). If you would like us to develop Acceleration Factors for your particular product and application environment, please contact Jean-Paul Clech at: jpclech@aol.com or call +1 (973)746-3796. * ASM Solder Joint Reliability Book: As previously reported (see February 2005 news below), Dr. Donkgai Shangguan (editor) of Flextronics and a panel of experts from around the world have put together a book on lead-free solder joint reliability. The publisher, ASM, has announced that orders are now being taken at pre-publication prices through September 30, 2005. For further information, download latest ASM flyer (includes tables of contents, price and ordering information). ______________________________________________________________________________________________ MARCH 2005 * Upcoming lead-free reliability workshops: San Jose, CA (May 4): full day workshop (the whole enchilada), to be held during Hobbs Engineering's 2005 HALT & HASS Symposium. For more info and registration, visit Hobbs Engineering Web Site. Nuremberg, Germany (April 19-21): a special workshop that we are offering with Dr. Gundolf Reichelt (IBE - Ingenieurbüro für Elektroniktechnologie, Berlin, Germany) and other European speakers during Mesago's SMT Hybrid Packaging exhibition and conference. This special lead-free reliability workshop has become an annual event where, along with Dr. Reichelt and other speakers, we present the latest findings on lead-free reliability testing and modeling. For more info and registration, visit Mesago's SMT Hybrid Packaging Web Site. Bethlehem, PA (March 11): full day workshop (the whole enchilada), sponsored by Hobbs Engineering. For more info and registration, visit Hobbs Engineering Web Site. _______________________________________________________________________________________________ FEBRUARY 2005 * Lead-free solder acceleration factors: new service, available now. Acceleration Factors (AFs) are now available for SnAgCu (SAC) electronic assemblies, enabling the extrapolation of thermal cycling failure times to product specific field conditions. We estimate SAC AFs for customer-specific packages, test and field conditions. For further information, contact Jean-Paul Clech: jpclech@aol.com * Upcoming lead-free reliability workshops: Anaheim, CA (Feb. 20): 1/2 day during IPC's Printed Circuit Expo / APEX conference. For more info and registration, visit the APEX 2005 Web Site. By popular demand, an electronic version of our APEX 2005 notes (presentation + documents) is available on CD- ROM. To place an order, go to Order Form for Half-Day LF Reliability Notes. *Special presentation at ECTC '05 (55th Electronics and Components Technology Conference), Orlando, FL (May 31-June 3): EPSI paper on lead-free solder creep curve simulations. Paper title: "An Extension of the Omega Method to Primary and Tertiary Creep of Lead-Free Solders", by Clech, J.- P. An innovative, user-friendly simulation technique that enables the easy prediction of entire creep curves and rupture times for soft solders. The companion analysis of creep curves shows that, contrary to conventional wisdom, lead-free solders do not experience much, if any, steady-state creep and that both primary and tertiary creep are dominant. For further info on ECTC 2005 and registration information, visit: http://www.ectc.net. *EPSI Inc. chapter contribution in ASM lead-free reliability book. New book: "Lead-Free Solder Interconnect Reliability" (edited by Dr. Dongkai Shangguan, Flextronics), ASM International, is scheduled to publish Summer / Fall 2005. Jean-Paul Clech, EPSI Inc., has contributed a chapter entitled: "Lead-Free Solder Joint Reliability Trends". Numerous experts from across the industry contributed on many aspects of lead-free reliability. The publication of this book is timely, less than 1 year prior to the lead-free conversion deadline, July 1, 2006. Book is highly recommended to all working on lead-free product conversion, lead- free product quality and reliability assurance. For further info, visit ASM International or download ASM Lead-Free Reliability Book Flyer . ______________________________________________________________________________________________ NOVEMBER 2004 "Lead-free solder and the automobile", by Larry Edson, GM Technical Fellow for Reliability and Accelerated Testing. An OEM perspective on lead-free solder reliability, first appeared in Hobbs Engineering's November 2004 newsletter, posted with permission of the author, Larry Edson of General Motors, and Hobbs Engineering. 2004 Archives 2003 Archives |