|EPSI INC. - Electronics Packaging Solutions International Inc.
P.O. Box 1522, Montclair, NJ 07042 USA, tel.: +1 (973)746-3796, fax: +1 (973)655-0815
" SOLDER JOINT RELIABILITY OF SMT, BGA, FLIP-CHIP AND CSP ASSEMBLIES" (2 DAYS)
A comprehensive in-house two-day program that provides a fundamental and in-depth understanding of solder joint fatigue,
practical guidelines to assess and build-in attachment reliability, and the latest information on the reliability of fine-pitch, area-
array and chip-scale-package assemblies. Includes possible hands-on use of the SRS software. Customized versions of this
seminar are available to better meet your organization’s needs. Download 2-day workshop description.
Added in 2003 (only in-house): All presentation files from our 2-day solder joint reliability workshop and associated
documentation [ including technical notes and write-ups (over 300 pages) plus an extensive reference list (in searchable .pdf
format) ] are provided on a master CD-ROM that includes a license for possible posting on your company web site.
NEW (in 2003): "SOLDER JOINT RELIABILITY OF LEAD-FREE ASSEMBLIES" (1 DAY)
An in-depth look at the reliability of lead-free soldered assemblies. Topics include: lead-free properties (creep, fatigue,
strength...), reliability data for common components (BGA, CSP, flip-chip, discretes, leaded components), effect of board
and component finish, reliability of mixed assemblies (e.g. SnAgCu + SnPb combinations), data correlations, lead-free vs.
SnPb comparisons, typical and unusual failure modes. Download Pb-free Workshop Description (2 pages)
Added in 2003 (only in-house): All presentation files from our lead-free reliability workshop, and associated documentation [
including technical notes plus an extensive reference list (in searchable .pdf format) ] are provided on a master CD-ROM that
includes a license for possible posting on your company web site.
NEW (since 2003): ON-LINE, WEBCAST INTERACTIVE SEMINARS
3 hour seminars, including Questions and Answers (Q&A), at your desk, company site or in the comfort of your living
room! Currently available: "Lead-Free Solder Joint Reliability: An Overview of the State of the Art" (2.5 hours + 1/2
hr Q&A). Call for customized topics.
All courses and seminars are run by Jean-Paul Clech (see biography). For further information on contents, customized
workshops and pricing, call +1 (973)746-3796 or send e-mail to firstname.lastname@example.org .
|Copyright EPSI Inc. 2005.