EPSI INC. - Electronics Packaging Solutions International Inc. P.O. Box 1522, Montclair, NJ 07042 USA, tel. & fax: +1 (973)746-3796 e-mail: jpclech@aol.com |
TECHNICAL PAPERS & ARTICLES: 2019
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2000 Clech, J-P., "Solder joint reliability of CSP versus BGA assemblies" (invited paper), Proceedings, System Integration in Micro Electronics, SMT ESS & Hybrids Conference, Nuremberg, Germany, June 27-29, 2000, pp. 19-28. Download Nuremberg 2000 paper (73kB .pdf file) . NOTE: recommended reading for users of the Solder Reliability Solutions (SRS) software.
Clech, J-P., "BGA, Flip-Chip and CSP solder joint reliability" (invited paper), Proceedings, MicroMat2000 Conference, Berlin, Germany, April 17-19, 2000, pp. 153-158. 1999 Reichelt, G. and Clech, J-P., "Life expectancy of solder joints SMD-PCB: comparing test data to an improved life prediction equation", Proceedings, Nepcon West '99, Anaheim, CA, February 21-25, 1999, Vol. III, pp. 1269-1285. 1998 Clech, J-P., "Flip-chip / CSP assembly reliability and solder volume effects", Proceedings, Surface Mount International Conference, San Jose, CA, August 25-27, 1998, pp. 315-324. Download SMI'98 paper (119kB .pdf file) . NOTE: recommended reading for users of the Solder Reliability Solutions (SRS) software. Paper shows the validation of the SRS model against accelerated thermal cycling test results for flip-chip, microBGA and ceramic CSP assemblies. Includes a new correlation of fatigue data with an empirical "solder volume correction factor" for small size solder joints (flip-chip, CSP assemblies). Model calibration factors to account for solder volume effects are defined in page 5 of this paper. Clech, J-P., "Flip-chip and chip-scale package reliability modeling", Chip Scale Review, Vol. 2, No. 5, November 1998, pp. 49-54 (out-of-print, no . pdf file available). 1997 Jean-Paul Clech and Joseph Fjelstad, "Reliability prediction of area-array CSPs", Electronic Packaging and Production, June 1997, pp. 91-96 (out- of-print, no .pdf file available). J-P. Clech, "SMT/CSP reliability perspectives", SMTA Newsletter, April 1997, p. 3. Download SMTA Newsletter Article (8kB .pdf file). J-P. Clech, "Tools to assess the attachment reliability of modern soldered assemblies (BGA, CSP...)", Proceedings, Nepcon West’97, Anaheim, CA, February 23-24, 1997, Vol. I, pp. 35-45. Download Nepcon West '97 paper (100kB .pdf file) . NOTE: recommended reading for users of the Solder Reliability Solutions (SRS) software. Includes description of procedure to estimate effective CTE of perimeter PBGA package. J-P.Clech, "Reliability challenges and modeling of miniaturized soldered assemblies" (invited paper), Proceedings, TMS’97, The Minerals, Metals Materials Society, Symposium on "Design and Reliability of Solders and Solder Interconnections", Orlando, FL., February 9-13, 1997, pp. 367- 375. Download TMS'97 paper (130kB .pdf file) . NOTE: recommended reading for users of the Solder Reliability Solutions (SRS) software. Includes details of underfill flip-chip strength model in appendix. 1996 J-P. Clech, "Solder Reliability Solutions: a PC-based design-for-reliability tool", Proceedings, Surface Mount International Conference, Sept. 8-12, 1996, San Jose, CA, pp. 136-151. Republished in Soldering and Surface Mount Technology, Wela Publications, British Isles, Vol. 9, No. 2, July 1997, pp. 45-54. Download SMI'96 paper (162kB .pdf file) . NOTE: recommended reading for users of the Solder Reliability Solutions (SRS) software. Paper gives basic description of SRS model, including validation across a database of thirty accelerated tests. Defines model terminology and software input, output parameters. J-P. Clech, "Strength and reliability of flip chip assemblies with underfill", EPSI Inc. Technical Publication, 1996 (available to licensed users of the SRS software upon request). J-P. Clech, "Solder reliability solutions: from LCCCs to area array assemblies", Proceedings, Nepcon West '96, Anaheim, CA, February 25-29, 1996, pp. 1665-1680. Download Nepcon West '96 paper (103kB .pdf file) . NOTE: recommended reading for users of the Solder Reliability Solutions (SRS) software. Paper gives a general description of the SRS model, including validation of the model against test results for full-array PBGA assemblies (with substrate thickness and pad size effects). OTHER PUBLICATIONS (with AT&T Bell Laboratories colleagues): 1996 Ejim, T. I. and Clech, J-P., "Moiré analysis and modeling of area array assemblies", Proceedings, VIII International Congress on Experimental and Applied Mechanics, Nashville, TN, June 10-12, 1996, pp. 53-54. Full paper in post-conference proceedings, Society for Experimental Mechanics, Bethel, CT, 1996. 1995 Ejim, T. I., Clech, J-P., Dudderar, T. D., Guo, Y. and Han, B., “Measurement of thermomechanical deformations of plastic ball grid array assemblies using moiré interferometry”, Proceedings, 1995 SEM Spring Conference and Exhibit, June 12-14, 1995, Grand Rapids, Michigan, pp. 121-125. 1994 Clech, J. P., Noctor, D. M., Manock, Lynott, G. W. and Bader, F. E., “Surface mount failure statistics and failure free time”, Proceedings, 44th ECTC, Washington, DC, May 1-4, 1994, pp. 487-497. Download ECTC'94 paper (186kB .pdf file) . Note: recommended reading if you are interested in the application of Three-Parameter (3P) Weibull distributions to the statistical analysis of solder joint failure times. 1993 Clech, J-P., Manock, J. C., Noctor, D. M., Bader, F. E. and Augis, J. A., "A Comprehensive Surface Mount Reliability model: background, validation and applications", Proceedings Surface Mount International ‘93, San Jose, CA, August 29-September 2, 1993, Vol. I, pp. 363-375. Download SMI'93 paper (86kB .pdf file) . Noctor, D. and Clech, J-P., “Accelerated testing and predictive modeling of the attachment reliability of alloy 42 and copper leaded TSOPs”, Proceedings, Nepcon East, Boston, MA, June 14-17, 1993, pp. 193-206. |
Copyright EPSI Inc. 2003-2019. Many of our papers and articles can be downloaded for free for personal use only. Other use, in print, electronically or otherwise, including posting on a public or internal web site is not permitted without authorization given in writing by EPSI Inc. |
Copyright EPSI Inc. 2003-2019. |