EPSI INC.  -  Electronics Packaging Solutions International Inc.
P.O. Box 1522, Montclair, NJ 07042 USA, tel. & fax: +1 (973)746-3796
e-mail:
jpclech@aol.com
WHAT WE DO
We work on the physical design, reliability and failure analysis of electronic components, solder joints and circuit-board assemblies.  We
provide expertise in the assessment of both standard tin-lead (SnPb) and lead-free (Pb-free) solder joint reliability.  
What is this about?

We help our customers meet the reliability requirements of electronic packages and circuit-board assemblies.  To that effect, we offer:
Consulting Services    Training Programs    Software Tools   Technical Support & Retainer Services   Expert-Witness Services

HOW WE DO IT
No hype, no unsupported claims...
We provide hard data, test plans and analysis along with recommendations for problem-solving or product improvements.  We maintain
and grow one of the largest databases of solder properties, reliability models and failure data in the electronics industry. Our
 Solder
Reliability Solutions (SRS) software is one of the most widely used solder joint life prediction program in industry
- see
Independent Reviews and Users' Comments .
JUNE 2015
    Electronic products marketed in the European Union, mainland China and a growing number of areas, must now meet lead-free
    requirements.  Are you concerned about lead-free reliability?  Give us a call and we'll help you figure it out.

NEWS & UPCOMING EVENTS

  • Coming soon: Solder Reliability Solutions ("SRS"), Version 2.0.

  • Paper: "BOARD, PACKAGE AND DIE THICKNESS EFFECTS UNDER THERMAL CYCLING CONDITIONS" by J-
    P. Clech to be given at SMTA International Conference, Chicago, IL, Sept. 29, 2015.  Will also co-chair session: "Lead-Free
    Solder Joint Reliability: Recent Advances" on Oct. 1, 2015 with Dr. Kola Akinade, Cisco Systems, Inc.


PAST NEWS

  • Webinar: "Lead-Free Solder Joint Reliability Basics", March 18, 2015.

POST-WEBINAR: recording of webinar is available by contacting
Hobbs Engineering, tel.:  (303) 655-3051

  • A 3-hour WEBCAST on Acceleration Factors for Lead Free Solder Joint Reliability - including a review of and
    discussion of SEVEN different acceleration factor models that have been developed for lead-free soldered assemblies -
was recorded on March 23, 2010.  

To get access to the presentation materials & audio recordings for this webinar, contact:
Virginia Hobbs at Hobbs Engineering:
learn@hobbsengr.com , tel.: +1 (303)655-3051.

  • Our 2009 SMTAI paper, presented with co-authors from the Hewlett-Packard Corporation at the
SMTA International (SMTAI) conference in San Diego, CA, has been selected
as
BEST OF PROCEEDINGS PAPER.  Download SMTAI 2009 presentation (.pdf file).

The paper: "
Closed form, strain energy based acceleration factors for thermal cycling of lead-free assemblies", by J-P. Clech,
Ph. D., Henshall, G., Ph. D. and Miremadi, J., can be purchased (with the 2009 SMTAI Proceedings) from the
SMTA bookstore at

http://www.smta.org/store/book_detail.cfm?book_id=358 .

Quote of the month (not necessarily monthly):

"The purpose of computing is insight, not numbers ", Richard W. Hamming.

...
Past Quotes of the Month.
Next public lead-free
reliability workshops:

None scheduled at the
moment.

Lead-Free (Pb*-free)
ain't Problem-free but
can be made as
reliable as need be.
Find out what the
issues are and how
they are being
addressed.





*Pb = Plumbum (Latin)
FOR FURTHER INFO, CONTACT:  Jean-Paul Clech ( bio), e-mail: jpclech@aol.com
Copyright EPSI Inc. 2003-2015.  This site was last updated on June 8, 2015
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