EPSI INC. - Electronics Packaging Solutions International Inc. P.O. Box 1522, Montclair, NJ 07042 USA, tel. & fax: +1 (973)746-3796 e-mail: jpclech@aol.com
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2009 CALENDAR OF PUBLIC WORKSHOPS AND SEMINARS
(UNDER CONSTRUCTION)
Visit this page often
as our calendar of
public workshops is
updated monthly.
In-house events are
not shown for
confidentiality reasons.
As much as possible,
overseas travel plans
are listed ahead of
time to facilitate the
scheduling of on-site
visits or consulting in
the same geographical
area.
Copyright EPSI Inc. 2003-2009.
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MONTH
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WHEN
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WHERE
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WORKSHOP / EVENT TYPE
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FURTHER INFO & REGISTRATION- CONTACT
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NOTES
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JAN. 2009
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FEB. 2009
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MARCH 2009
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APRIL 2009
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MAY 2009
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JUNE 2009
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JUNE 10-11
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MINNEAPOLIS, MN
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2 day lead-free solder joint reliability
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Info at Hobbs' Engineering web site.
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JULY 2009
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AUGUST 2009
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SEPT. 2009
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Sept. 24
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Schaumburg, IL
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1/2 Day:Accelerated Thermal Cycling and Acceleration Factors for Lead-Free Surface Mount Assemblies
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IPC Midwest web site (registration)
Workshop description
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2-5pm
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OCT. 2009
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NOVEMBER 2009
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Nov. 12
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Irvine, CA
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1/2 Day: Lead-Free Reliability Workshop: Solder properties and their impact on attachment reliability and acceleration factors for lead-free and surface-mount assemblies
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IPC Materials Conference
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8-11:30am
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DECEMBER 2009
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