EPSI INC.  -  Electronics Packaging Solutions International Inc.
P.O. Box 1522, Montclair, NJ 07042 USA, tel. & fax: +1 (973)746-3796
e-mail:
jpclech@aol.com
2009 CALENDAR OF PUBLIC WORKSHOPS AND SEMINARS

(UNDER CONSTRUCTION)
Visit this page often
as our calendar of
public workshops is
updated monthly.

In-house events are
not shown for
confidentiality reasons.

As much as possible,
overseas travel plans
are listed ahead of
time to facilitate the
scheduling of on-site
visits or consulting in
the same geographical
area.
Copyright EPSI Inc. 2003-2009.  
You need Java to see this applet.
FOR FURTHER INFO, CONTACT:  Jean-Paul Clech ( bio), e-mail: jpclech@aol.com
MONTH
WHEN
WHERE
WORKSHOP /
EVENT TYPE
FURTHER INFO &
REGISTRATION-
CONTACT
NOTES
JAN. 2009
         
FEB. 2009
         
MARCH 2009
         
APRIL 2009
         
MAY 2009
         
JUNE 2009
JUNE 10-11
MINNEAPOLIS, MN
2 day lead-free
solder joint reliability
Info at Hobbs'
Engineering web site.
 
JULY 2009
         
AUGUST
2009
         
SEPT. 2009
Sept. 24
Schaumburg, IL
1/2 Day:Accelerated
Thermal Cycling and
Acceleration Factors
for Lead-Free
Surface Mount
Assemblies
IPC Midwest web site
(registration)

Workshop description
2-5pm
OCT. 2009
         
NOVEMBER
2009
Nov. 12
Irvine, CA
1/2 Day:
Lead-Free Reliability
Workshop: Solder
properties and their
impact on
attachment reliability
and acceleration
factors for lead-free
and surface-mount
assemblies
IPC Materials
Conference
8-11:30am
DECEMBER
2009