EPSI INC.  -  Electronics Packaging Solutions International Inc.
P.O. Box 1522, Montclair, NJ 07042 USA, tel. & fax: +1 (973)746-3796
e-mail: jpclech@aol.com
WHAT WE DO
We work on the physical design, reliability and failure analysis of electronic components, solder joints and circuit-board assemblies.  We
provide expertise in the assessment of both standard tin-lead (SnPb) and lead-free (Pb-free) solder joint reliability.  What is this about?

We help our customers meet the reliability requirements of electronic packages and circuit-board assemblies.  To that effect, we offer:
Consulting Services    Training Programs    Software Tools   Technical Support & Retainer Services   Expert-Witness Services

HOW WE DO IT
No hype, no unsupported claims...
We provide hard data, test plans and analysis along with recommendations for problem-solving or product improvements.  We maintain
and grow one of the largest databases of solder properties, reliability models and failure data in the electronics industry. Our  Solder
Reliability Solutions (SRS) software is one of the most widely used solder joint life prediction programs in industry
- see Independent Reviews and Users' Comments .

OUR MOTTO:  THERE IS NO SHORTCUT TO RELIABILITY.
2009
CALENDAR
OF PUBLIC
WORKSHOPS
DECEMBER 2009

    Electronic products marketed in the European Union, mainland China and a growing number of areas, must now meet
    lead-free requirements.  How reliable are your lead-free assemblies?  Give us a call and we'll help you figure it out.

  • UPCOMING SEMINARS / WORKSHOPS:

  • None is presently scheduled.  Watch for updated schedule in early 2010.

- Three to four workshops on various aspects of lead-free reliability are  being scheduled
at four different venues in Europe in the Spring of 2010 (more later).

- A NEW WEBCAST (2.5 - 3 hours) on Acceleration Factors for Lead Free Solder Joint Reliability - including a review of
and discussion of SEVEN different acceleration factor models that have been developed for lead-free soldered assemblies -
will be offered in the 2010 February time-frame.  This includes the presentation of new validation data for the model we developed with
Hewlett-Packard and presented at SMTAI 2009 (see announcement below).


  • OTHER NEWS:

Our 2009 SMTAI paper, presented with co-authors from the Hewlett-Packard Corporation at the
SMTA International (SMTAI) conference in San Diego, CA, this past October, has been selected
as BEST OF PROCEEDINGS PAPER.

The paper: "Closed form, strain energy based acceleration factors for thermal cycling of lead-free assemblies", by J-P. Clech,
Ph. D., Henshall, G., Ph. D. and Miremadi, J., can be purchased (with the 2009 SMTAI Proceedings) from the SMTA bookstore at

http://www.smta.org/store/book_detail.cfm?book_id=358 .


  • Quote of the month (not necessarily monthly):

"Quality means doing it right when no one is looking", Henry Ford.

...Past Quotes of the Month.
Next public lead-free
reliability workshops:

None scheduled.
Watch for schedule
update in January
2010.

Lead-Free (Pb*-free)
ain't Problem-free but
can be made as
reliable as need be.
Find out what the
issues are and how
they are being
addressed.





*Pb = Plumbum (Latin)
FOR FURTHER INFO, CONTACT:  Jean-Paul Clech ( bio), e-mail: jpclech@aol.com
Copyright EPSI Inc. 2003-2009.  This site was last updated on Dec. 20, 2009
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